2026 IEEE/JSAP Symposium on VLSI Technology & Circuits

Hilton Hawaiian Village

Jun 14 - 19, 2026

Hilton Hawaiian Village

Honolulu, United States

Jun 14 - 19, 2026

Honolulu, United States

About the Conference

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits will be held as an in-person event with on demand content. The Symposium will feature selected presentations and panel sessions as well as advanced VLSI technology developments, innovative circuit designs, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud / edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles.

Subject Areas

Scope

Important Dates

2025-12-02 Submission Site Open CLOSED

2026-01-26 Submission Deadline · 23:59 PST (Tuesday, January 27, 2026, 07:59 GMT / Tuesday, January 27, 2026, 16:59 JST) CLOSED

2026-03-30 Late News Deadline · 23:59 PST CLOSED

TBD Notification of Acceptance · around the middle of April 2026

2025-12-31 Workshop Submission Deadline · Extended CLOSED

TBD Workshop Decision · January 2026

2026-05-18 Late Registration Start · In-Person & OnDemand CLOSED

2026-06-14 Conference Dates · June 14-18, 2026 CLOSED

Call For Papers

Scope

Advanced CMOS Platforms, Interconnect and Backside Power Delivery Network (BSPDN) Technologies Advanced Packaging, Chiplet and Heterogeneous Integration Technologies Including 2.5D and 3D Analog and Mixed-Signal Circuits Beyond CMOS Devices That Utilize New Physics Including Spin, Optical and Quantum Computing Biomedical Devices, Circuits, and Systems Computing/Processing in Memory Data Converters Device Physics, Characterization, Modeling and Reliability Devices and Accelerators For ML/DL and New Compute Digital Circuits, Hardware Security, Signal Integrity, IOs DTCO and Design Enablement Frequency Generation and Clocking Circuits Memory Technologies, Devices, Circuits, and Architectures Power Management Devices and Circuits Processes and Materials for CMOS Scaling and New Devices Processors and SoCs Sensors, Imagers, IoT, MEMS, Display Circuits Wireless and RF Devices Circuits and Systems Wireline and Optical Transceivers, Optical Interconnects and Processors

Publication & Indexing

ProceedingsDigest of Technical Papers

Conference Organization

In cooperation with

IEEE JSAP Canfield Event Management JTB Communication Design, Inc.

Committee

Symposium Chair

Ron Kapusta

Analog Devices

Vijay Narayanan

IBM T.J. Watson Research Center

Symposium Co-Chair

Sugako Otani

Renesas Electronics Corporation

Kazuhiko Endo

Tohoku University

Program Chair

Benjamin Colombeau

Applied Materials

John Wuu

Advanced Micro Devices

Program Co-Chair

Makoto Takamiya

The University of Tokyo

Masaharu Kobayashi

The University of Tokyo

IEEE Executive Committee Chair

Stephen Kosonocky

AMD

JSAP Executive Committee Chair

Toshiro Hiramoto

The University of Tokyo

Secretary

Yue Liang

nVidia

Alvin Loke

Intel Corporation

Shosuke Fujii

Kioxia Corporation

Masanao Yamaoka

Hitachi, Ltd.

Evening Panel Chair

Jixin Yu

Sandisk

Evening Panel

Farhana Sheikh

Intel Corporation

Short Course Chair

Anabela Veloso

imec

Vanessa Chen

Carnegie Mellon University

Publication Chair

Thanh Viet Dinh

NXP Semiconductors

Bruce Rae

STMicroelectronics

Ryuta Tsuchiya

Hitachi, Ltd.

Best Student Paper Award Chair

Elisa Vianello

CEA-LETI

Phillip Nadeau

Analog Devices

Demo Session Chair

Nandakumar "Nandu" Mahalingam

Texas Instruments

Zeynep Toprak-Deniz

IBM Research

Focus Session Chair

Hsinyu (Sidney) Tsai

IBM

Workshop Chair

Alessandro Calderoni

Micron

Inhee Lee

University of Pittsburgh

Publicity Chair

Qinwen Fan

TU Delft

Virtual Arrangements Chair

Jaydeep Kulkarni

University of Texas at Austin

Publicity Co-Chair

Yoshiki Yamamoto

Renesas Electronics Corporation

Kentaro Yoshioka

Keio University

Evening Panel Co-Chair

Tetsu Ohtou

Tokyo Electron Limited

Tetsuya Iizuka

The University of Tokyo

Short Course Co-Chair

Yoshiaki Kikuchi

Sony Semiconductor Solutions

Kenichi Okada

Institute of Science Tokyo

Best Student Paper Award Co-Chair

Tomohiko Kudo

Micron Memory Japan, G.K.

Satoru Takase

Kioxia Corporation

Demo Session Co-Chair

Tuo-Hung Hou

National Yang Ming Chiao Tung University

Hirotomo Ishii

Toshiba Electronic Devices & Storage Corporation

Focus Session Co-Chair

Kazuyuki Tomida

Rapidus Corp.

Koji Nii

TSMC Design Technology Japan, Inc.

Workshop Co-Chair

Jin Cai

TSMC

Tomohiro Nezuka

MIRISE Technologies Corporation

Treasurer

Masahiko Kanda

Toshiba Electronic Devices & Storage Corporation

Virtual/Local Co-Chair

Shuichi Nagai

Panasonic Industry Co., Ltd.

IEEE Executive Committee Member

Edith Beigne

Meta

Andreia Cathelin

STMicroelectronics

Chorng-Ping Chang

Ken Chang

Marvell

Benjamin Colombeau

Applied Materials

Ichiro Fujimori

Broadcom Corp.

Brian Ginsburg

Texas Instruments

Naoto Horiguchi

imec

Raj Jammy

MITRE Engenuity

Gosia Jurczak

Lam Research

Ron Kapusta

Analog Devices

Jack Kavalieros

Intel

Gunther Lehmann

Infineon Technologies AG

Kofi Makinwa

TU Delft

Vijay Narayanan

IBM T. J. Watson Research Center

Borivoje Nikolic

University of California, Berkeley

Tomas Palacios

MIT

John Wuu

Advanced Micro Devices

JSAP Executive Committee Member

Steve S. Chung

National Yang Ming Chiao Tung University

Kazuhiko Endo

Tohoku University

Mototsugu Hamada

The University of Tokyo

Makoto Ikeda

The University of Tokyo

Masaharu Kobayashi

The University of Tokyo

Masato Koyama

KIOXIA Corporation

Meishoku Masahara

National Institute of Advanced Industrial Science and Technology

Yuri Masuoka

Samsung Electronics Co., Ltd.

Hidetoshi Matsumura

Fujitsu, Ltd

Katsura Miyashita

Toshiba Electronic Devices & Storage Corp.

Katsu Nakamura

Analog Devices, K.K.

Yusuke Oike

Sony Semiconductor Solutions Corp.

Sugako Otani

Renesas Electronics Corporation

Makoto Takamiya

The University of Tokyo

Ken Takeuchi

The University of Tokyo

Jun Terada

NTT Device Technology Labs.

Takaaki Tsunomura

Tokyo Electron Ltd.

Hitoshi Wakabayashi

Tokyo Institute of Technology

Shien-Yang Wu

TSMC

Shinya Yamakawa

Sony Semiconductor Solutions Corp.

Hoi-Jun Yoo

KAIST

Technology Track Member

Mustafa Badaroglu

Qualcomm

Xinyu Bao

tsmc

Gary Bronner

Rambus

Ming Cai

Google

Suraj Cheema

MIT

Gilbert Dewey

Intel

Srabanti Chowdhury

Stanford University

Chris Hinkle

Notre Dame

Karl Hofmann

Infineon

Rashmi Jha

University of Cincinnati

Asif Khan

Georgia Tech

Russell McMullan

AMD

Thomas Mikolajick

NamLab

Johannes Muller

GlobalFoundries

Vamsi Paruchuri

ASM

Harsono Simka

Samsung

Olivier Weber

ST Microelectronics

Naomi Yoshida

Applied Materials

Rock-Hyun Baek

Pohang University of Science & Technology

Shou-Zen Chang

PSMC

Vita Pi-Hu Ho

National Taiwan University

Toshifumi Irisawa

AIST

Jaehun Jeong

Samsung Electronics Co., Ltd.

Deoksin Kil

SK Hynix

Sanghyeon Kim

KAIST

Yoichiro Kurita

Institute of Science Tokyo

Rihito Kuroda

Tohoku University

Hang-Ting Lue

Macronix International Co., Ltd.

Hiroshi Morioka

Socionext Inc.

Shiro Ozaki

NTT, Inc.

Mitsuru Takenaka

The University of Tokyo

Aaron Voon-Yew Thean

National University of Singapore

Masafumi Tsutsui

Tower Partners Semiconductor

Huaqiang Wu

Tsinghua University

Circuits Track Member

Stephen Brink

Texas Instruments

Martin Brox

Micron Technology, Inc.

Andreas Burg

EPFL; RAAAM Memory Technologies

Trevor Caldwell

Alphawave Semi

Yu-Hsin Chen

EnCharge AI

Markus Dielacher

Infineon Technologies

Jonathan Douglas

Advanced Micro Devices

Gautam Gangasani

Apple

Ben Keller

NVIDIA

Chris Kim

University of Minnesota

Kevin Kornegay

Morgan State University

Lindsey Kostas

Qualcomm Inc.

Jorge Lagos Benites

Imec Vlaanderen

Yan Li

Sandisk Corp.

Carolina Maria Lopez

imec

Cormac O'Connell

TSMC

Erik Olieman

NXP Semiconductors

Samuel Palermo

Texas A&M University

Matteo Perenzoni

Sony Semiconductors Solutions Europe

Gael Pillonnet

CEA-Leti

Harold Pilo

Cadence

Emmanual Quevy

Probius

Ayman Shabra

MediaTek Inc.

Sophia Shao

University of California, Berkeley

Mahmut Ersin Sinangil

Nvidia

Jason T. Stauth

Dartmouth College

Thierry Tambe

Stanford University

Anand Vasani

Broadcom

Samira Zaliasl

Ferric Inc.

Ibrahim Abdo

NTT, Inc.

Meng-Fan (Marvin) Chang

National Tsing Hua University (NTHU) & TSMC

Po-Hung Chen

National Yang Ming Chiao Tung University

Wei Deng

Tsinghua University

Kazuki Fukuoka

Renesas Electronics Corporation

Sung-Wan Hong

Seoul National University (SNU)

Vinayak Honkote

Intel Corporation

Hoesam Jeong

SK Hynix

Wangyeong Jung

Korea Advanced Institute of Science and Technology (KAIST)

Hyung-Min Lee

Korea University

Youngjoo Lee

Korea Advanced Institute of Science and Technology (KAIST)

Xun Liu

The Chinese University of Hong Kong, Shenzhen

Wei-Chung Lo

Industrial Technology Research Institute (ITRI)

Noriyuki Miura

Osaka University

Makoto Miyamura

NanoBridge Semiconductor, Inc.

Yohei Nakamura

Hitachi, Ltd.

Chihiro Okada

Sony Semiconductor Solutions Corp.

Shunsuke Okura

Ritsumeikan University

Yukihiro Sasagawa

Socionext Inc.

Chun Shiah

Etron Technology, Inc.

Wongyu Shin

Rebellions Inc.

Yun-Shiang Shu

MediaTek Inc.

Sai-Weng Sin

University of Macau

Kyomin Sohn

Samsung Electronics Co., Ltd.

Tomohiro Takahashi

Samsung Japan Corporation

Hisakatsu Yamaguchi

Fujitsu Ltd.

Chia-Hsiang Yang

National Taiwan University

Jerald Yoo

Seoul National University

Heein Yoon

Ulsan National Institute of Science and Technology (UNIST)

C. Patrick Yue

Hong Kong University of Science and Technology & Stanford University