2027 IEEE International Solid-State Circuits Conference (ISSCC)

San Francisco Marriott Marquis

Feb 14 - 19, 2027

San Francisco Marriott Marquis

San Francisco, United States

Feb 14 - 19, 2027

San Francisco, United States

About the Conference

The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts.

Subject Areas

ANALOG DATA CONVERTERS DIGITAL CIRCUITS, ARCHITECTURES & SYSTEMS* IMAGE SENSORS & DISPLAYS** MEDICAL** MEMORY POWER MANAGEMENT RF CIRCUITS & WIRELESS SYSTEMS*** SECURITY TECHNOLOGY DIRECTIONS WIRELINE

Keynote Speakers

Marco Pieters

Executive Vice President and Chief Technology Officer · ASML

Yusuke Oike

CTO / Senior Vice President, R&D · Sony Semiconductor Solutions

Matt Murphy

Chairman and CEO · Marvell

Rani Borkar

President, Azure Hardware Systems and Infrastructure · Microsoft

Important Dates

2026-09-09 Submission deadline · Wednesday, September 9, 2026 · 3:00 PM EDT NEXT

2026-07-01 Submission Website opens CLOSED

2026-10-21 Notice of acceptance

2027-02-14 Conference Dates · February 14-18, 2027 · San Francisco Marriott Marquis

Call For Papers

ANALOG

Circuits with analog-dominated innovation; amplifiers, comparators, oscillators, filters, references; nonlinear analog circuits; digitally assisted analog circuits; sensor interface circuits; MEMS sensor/actuator interfaces, analog front-ends; analog circuits in sub-10nm scaled technologies.

DATA CONVERTERS

Nyquist-rate and oversampling A/D and D/A converters; embedded and application-specific converters; time-to-digital converters; S&H circuits. Focus is on innovative and emerging converter architectures and integration advantages within larger systems, rather than the figure of merit of isolated converters. Consider converter peripherals (input, reference, clock drivers); calibration should focus on innovation, robustness, and practical usability.

DIGITAL CIRCUITS, ARCHITECTURES & SYSTEMS*

Digital circuits, building blocks, architectures and HW optimizations of complete systems (monolithic, chiplets, 2.5D, 3D) for micro/application/graphics/automotive/ML/AI and SoC processors; accelerators for communications, video, cloud and datacenter; reconfigurable, near-/sub-threshold and approximate computing; intra-chip communication, clocking (PLLs/DLLs), soft-error/variation tolerance, power management; ML/AI systems including near- and in-memory computation and hardware for transformers, graph and spiking networks, and hyper-dimensional computing.

IMAGE SENSORS & DISPLAYS**

Image sensors; vision sensors including event-based and computer sensors; LiDAR, time-of-flight and depth sensing; ML and edge computing for imaging; display drivers, touch sensing, haptic displays, and interactive display/sensing for AR/VR.

MEDICAL**

Medical devices; biomedical sensors and SoCs; brain-computer and neural interfaces and closed-loop systems; wearable, implantable, and ingestible devices; ultrasound and medical imaging; medical optical microsystems; body-area networks; wireless power/communication to implants; ML and edge computing for medical applications; combinatorial innovation including sensor fusion for disruptive clinical outcomes.

MEMORY

Static, dynamic, and non-volatile memories for stand-alone and embedded applications; memory/SSD controllers; high-bandwidth I/O for memories; phase-change, magnetic, STT, ferroelectric, and resistive memories; array architectures for low-voltage operation, power, reliability, performance, fault tolerance; in-memory and near-memory computing macros for AI and other applications.

POWER MANAGEMENT

Power management, delivery, and control; switched-mode converter ICs (inductive, capacitive, piezoelectric, hybrid); LDO/linear regulators; power delivery for heterogeneous and 2.5/3D integration; gate drivers; wide-bandgap (GaN/SiC) designs; isolated and wireless converters; envelope supply modulators; energy harvesting; power management for automotive/harsh environments, robotics, LED drivers, and LiDAR.

RF CIRCUITS & WIRELESS SYSTEMS***

Complete solutions and building blocks at RF, mm-Wave, and THz for receivers, transmitters, synthesizers, RF filters, front-end modules, multi-element transceivers, SoCs, and wireless SiPs with multiple chiplets; techniques and heterogeneous packaging for established and emerging wireless standards and novel applications such as sensing, radar, imaging, satellite communications, integrated sensing and communications, and IoT.

SECURITY

Cryptographic accelerators (classical, PQC, FHE, and protocols such as ZKP, MPC, OT); smart-card security; trusted and confidential computing; secure processors and memories; security primitives (PUFs, TRNGs, secure OTPs, side-channel/fault countermeasures); security for resource-constrained systems; secure analog/mixed-signal/RF; secure supply chains; security for/with AI; secure system design and HW/SW co-design.

TECHNOLOGY DIRECTIONS

Emerging IC, system, and device solutions: integrated photonics and silicon electronic-photonic integration; quantum devices for metrology/sensing/computing; flexible, stretchable, foldable, printable, and 3D electronics; biomedical/chemical sensors; wireless power transfer at distance; ICs for space and extreme environments; unconventional platforms for computing and ML including analog/mixed-signal; AI for analog automated IC design; integrated meta-materials and alternative device platforms.

WIRELINE

Receivers/transmitters/transceivers for wireline systems: backplane, copper-cable, chip-to-chip, die-to-die, on-chip/on-package links, high-speed memory interfaces; optical links and silicon photonics; exploratory I/O for data rate, bandwidth density, power efficiency, equalization, robustness; building blocks such as AGCs, AFEs, ADC/DAC/DSPs, TIAs, equalizers, clock generation/distribution (PLLs/DLLs), clock recovery, line drivers, and hybrids.

Publication & Indexing

ProceedingsDigest of Technical Papers

Conference Organization

Supported by

IEEE SSCS

Committee

Conference Chair

Thomas Burd

Advanced Micro Devices, Santa Clara, CA

Past Conference Chair

Edith Beigné

Meta, Menlo Park, CA

Steering Committee Chair

Anantha Chandrakasan

Massachusetts Institute of Technology, Cambridge, MA

Invited Sessions Chair

Vivek De

Intel, Hillsboro, OR

Demo Session Chair

Drew Hall

University of California at San Diego, La Jolla, CA

Press Coordinator

Shahriar Mirabbasi

University of British Columbia, Vancouver, Canada

Press Liaison

Laura Fujino

University of Toronto, Toronto, Canada

Social Media Chair

Vito Giannini

OLIX Computing, Austin, TX

Web Site & A/V Chair

Trudy Stetzler

Houston, TX

Program Chair

Marian Verhelst

KU Leuven & imec, Belgium

Program Vice-Chair

Stefano Pellerano

Intel, Hillsboro, OR

Past Program Chair

Keith Bowman

Qualcomm, Raleigh, NC

Exhibition Chair

Eric Karl

Intel

Education Chair

Ali Sheikholeslami

University of Toronto, Toronto, Canada

SRP Chair

Rabia Tugce Yazicigil

Boston University, Boston, MA

WIC Representative

Zeynep Toprak Deniz

IBM Research, Yorktown Heights, NY

AdCom Representative

Eugenio Cantatore

Eindhoven University of Technology, Eindhoven, The Netherlands

Jan van der Spiegel

University of Pennsylvania, Philadelphia, PA

ITPC APAC (Asia Pacific) Regional Chair

Kousuke Miyaji

Shinshu University, Nagano, Japan

ITPC APAC (Asia Pacific) Regional Vice-Chair

Jun Yin

University of Macau, Macau, China

ITPC EWAA (Europe, West Asia, Africa) Regional Chair

Qinwen Fan

Delft University of Technology, Delft, The Netherlands

ITPC EWAA (Europe, West Asia, Africa) Regional Vice-Chair

Frank Prämaßing

Infineon Technologies Austria AG, Villach, Austria

ITPC AM (Americas) Regional Chair

Chris Rudell

University of Washington, Seattle, WA

ITPC AM (Americas) Regional Vice-Chair

Carlos Tokunaga

Intel, Hillsboro, OR

Director of Publications

Laura Fujino

University of Toronto, Toronto, Canada

Director of Operations

Melissa Widerkehr

Widerkehr and Associates, Lewes, DE

Plenary Chair

Anantha Chandrakasan

Massachusetts Institute of Technology, Cambridge, MA

Plenary Co-Chair

Marian Verhelst

KU Leuven & imec, Belgium

Member

Keith Bowman

Qualcomm, Raleigh, NC

Laura Fujino

University of Toronto, Toronto, Canada

Thomas Burd

Advanced Micro Devices, Santa Clara, CA

Stefano Pellerano

Intel, Hillsboro, OR

ITPC EWAA (Europe, West Asia, Africa) Regional Secretary

Harijot Singh Bindra

University of Twente, Enschede, The Netherlands

ITPC APAC (Asia Pacific) Regional Secretary

Kyeongha Kwon

KAIST, Daejeon, Korea

ITPC AM (Americas) Regional Secretary

Vanessa Chen

Carnegie Mellon University, Pittsburgh, PA

Analog Subcommittee Chair

Viola Schaffer

Texas Instruments, Freising, Germany

Data Converters Subcommittee Chair

Pieter Harpe

Eindhoven University of Technology, Eindhoven, The Netherlands

Digital Architectures & Systems (DAS) Subcommittee Chair

Rahul Rao

IBM India, Bangalore, India

Digital Circuits (DCT) Subcommittee Chair

Huichu Liu

OpenAI, San Francisco, CA

Image Sensors and Displays (ISD) Subcommittee Chair

Bruce Rae

STMicroelectronics, Edinburgh, United Kingdom

Medical Subcommittee Chair

Jerald Yoo

Seoul National University, Seoul, Korea

Memory Subcommittee Chair

John Wuu

Advanced Micro Devices, Fort Collins, CO

Power Management Subcommittee Chair

Saurav Bandyopadhyay

Texas Instruments, Dallas, TX

Power Management Subcommittee Vice-Chair

Patrick Mercier

University of California, San Diego, La Jolla, CA

RF Subcommittee Chair

Brian Ginsburg

Texas Instruments, Dallas, TX

RF Subcommittee Vice-Chair

Jaehyouk Choi

Seoul National University, Seoul, Korea

Security Subcommittee Chair

Takeshi Sugawara

The University of Electro-Communications, Tokyo, Japan

Technology Directions (TD) Subcommittee Chair

Alyosha Molnar

Cornell University, Ithaca, NY

Wireless Subcommittee Chair

Negar Reiskarimian

Massachusetts Institute of Technology (MIT), Cambridge, MA

Wireline Subcommittee Chair

Thomas Toifl

Cisco Systems, Thalwil, Switzerland

Technical Editor

Jason H. Anderson

University of Toronto, Toronto, Canada

Leonid Belostotski

The University of Calgary, Calgary, Canada

Dustin Dunwell

Alphawave IP, Toronto, Canada

Vincent Gaudet

University of Waterloo,Waterloo, Canada

Glenn Gulak

University of Toronto, Toronto, Canada

James W. Haslett

The University of Calgary, Calgary, Canada

Shahriar Mirabbasi

University of British Columbia, Vancouver, Canada

Samantha Murray

StarIC, Toronto, Canada

Multi-Media Coordinator and Digest Editor

David Halupka

StarIC, Toronto, Canada