About the Conference
The IEEE International Symposium on Circuits and Systems (ISCAS) is the flagship conference of the IEEE Circuits and Systems Society and the world’s premier forum for researchers in the active fields of theory, design and implementation of circuits and systems. ISCAS 2026 is driven by the theme “Circuits and Systems for Intelligent Society”, catalyzing transformative innovation at the intersection of circuits, systems, and Artificial Intelligence to faster the development of a smart and sustainable society. The symposium highlights a wide range of innovatition themes including: Artificial Intelligence and Deep Learning, Smart Systems for Automotive, Brain: Innovation Neurotechnologies, Intelligent Cyber Security Systems, Food Security and Climate Change, Ultra Low Power Circuits and Systems.
Subject Areas
Keynote Speakers
Tingbo He
President of HUAWEI Semiconductor, Director of HUAWEI Scientist Committee · Huawei, China
Jian-Wei Pan
Professor of Physics · University of Science and Technology of China
M. Jamal Deen
Distinguished University Professor, Dr. Haykin Distinguished Engineering Professor · McMaster University, Canada
Giovanni De Micheli
Scientific Director, EcoCloud Center · EPFL Lausanne, Switzerland
Howard C. Yang
Chairman and CEO · Montage Technology, China
Important Dates
Call For Papers
Symposium Themes
Conference Organization
Organized by
Committee
Honorary Chair
Junfa Mao
Shenzhen University, China
General Co-Chair
Yong Lian
York University, Canada
Ming Liu
Fudan University, China
Shao-Jun Wei
Tsinghua University, China
Gianluca Setti
Politecnico di Torino
TPC Co-Chair
Wei-Sheng Zhao
Beihang University, China
Xinmiao Zhang
Ohio State University, USA
Eduard Alarcon
UPC Barcelona Tech, Spain
Yoshifumi Nishio
Tokushima University, Japan
Plenary Co-Chair
Zhihua Wang
Tsinghua University, China
Mohamad Sawan
Westlake University, China
David Allstot
Carnegie Mellon University, USA
Finance Co-Chair
Jian Zhao
Shanghai Jiao Tong University, China
Di He
Shanghai Jiao Tong University, China
Special Session Co-Chair
Yajun Ha
Shanghai Tech University, China
Elena Blokhina
University College Dublin, Ireland
Malgorzata Chrzanowska-Jeske
Portland State University, USA
Tutorial Co-Chair
Li Li
University Science and Technology of China, China
Yang Zhao
Shanghai Jiao Tong University, China
Patricia Desgreys
Telecom Paris, France
Shahriar Mirabbasi
University of British Columbia, Canada
Cross Society Session Co-Chair
Yongfu Li
Shanghai Jiao Tong University, China
Xiaojun Guo
Shanghai Jiao Tong University, China
Shouyi Yin
Tsinghua University, China
Qing Luo
CAS Institute of Microelectronics, China
Demo Co-Chair
Peiling Liu
Shanghai Jiao Tong University, China
Philipp Hafliger
University of Oslo, Norway
Xilin Liu
University of Toronto, Canada
WiCAS and YPCAS Co-Chair
Julia Chung
National Cheng Kung University
Yoko Uwate
Tokushima University, Japan
Ying Wei
Shandong University, China
Industry Advisory and Entrepreneurship Co-Chair
Howard Yang
Montage Technology, China
Yu Wang
Tsinghua University, China
Yen-Kuang Chen
Intel, USA
Jie Chen
Fudan University, China
Publication Co-Chair
Li Geng
Xi'an Jiao Tong University, China
Jianjun Zhou
Shanghai Jiao Tong University, China
Wei Mao
Xidian University, China
Web Master
Xiangting Li
Shanghai Jiao Tong University, China
Publicity Co-Chair
Boxiao Liu
East China Normal University, China
Le Ye
Peking University, China
Leibo Liu
Tsinghua University, China
Huaqiang Wu
Tsinghua University, China
Yongpan Liu
Tsinghua University, China
Xiaokang Yang
Shanghai Jiao Tong University, China
Jun Zhou
University of Electronic Science and Technology of China, China
Zhongfeng Wang
Sun Yat-Sen University, China
Zhangming Zhu
Xidian University, China
Gengquan Han
Xidian University, China
Jun Yang
Southeast University, China
Xiaoyang Zeng
Fudan University, China
Exhibits Co-Chair
Jing Jin
Shanghai Jiao Tong University, China
Yongxin Zhu
CAS Shanghai Advanced Research Institute, China
Local Arrangement Co-Chair
Yan Liu
Shanghai Jiao Tong University, China
Liang Qi
Shanghai Jiao Tong University, China
International Liaison
Myung Hoon Sunwoo
Ajou University, South Korea
An-Yeu (Andy) Wu
National Taiwan University
Amara Amara
Beihang University, China
Kea-Tiong (Samuel) Tang
National Tsing Hua University
Fakhrul Zaman Rokhani
Universiti Putra Malaysia, Malaysia
Francois Rivet
Bordeaux Institute of Technology, France
Keshab K. Parhi
University of Minnesota, USA
Jennifer Blain Christen
Arizona State University, USA
Carlos Silva-Cardenas
Universitat Autònoma de Barcelona, Spain
Jose M. de la Rosa
Instituto de Microelectrónica de Sevilla, Spain
Edoardo Bonizzoni
University of Pavia, Italy
Shan Liu
Tencent America, USA
Pedram Mohseni
Case Western Reserve University, USA
Nicole McFarlane
University of Tennessee, USA
Yiran Chen
Duke University, USA
