About the Conference
2027 6th International Symposium on Computer Applications and Information Technology (ISCAIT 2027) will be held on January 15-17, 2027 in Chengdu, China.
ISCAIT 2027 focuses on the frontier research fields of new-generation information technology, information processing, communication technology, computer science fundamentals, computer software, computer networks, etc. The conference aims to promote the development of China's computer information field, expand international channels of scientific and technological academic exchange, build a platform for sharing academic resources, promote scientific and technological innovation on a global scale, and enhance academic cooperation between China and abroad. The conference also aims to encourage information exchange at the forefront of research in different fields, connect the most advanced academic resources at home and abroad, transform research results into industrial solutions, and bring together talents, technologies and capital to promote development.
Note: In view of the academic exchange and development of the conference, the conference committee decided to change the conference title from "International Symposium on Computer Applications and Information Systems (ISCAIS)" to "International Symposium on Computer Applications and Information Technology (ISCAIT)" from the fourth session onwards. ISCAIT is an annual conference and we welcome experts and scholars from all over the world to participate and exchange ideas.
Subject Areas
Keynote Speakers
Angela Yingjun Zhang
Professor, IEEE Fellow · The Chinese University of Hong Kong
Xin Wang
Professor, IEEE Fellow · Fudan University
Tony Q.S. Quek
Professor, IEEE Fellow, Fellow of Singapore Academy of Engineering · Singapore University of Technology and Design, Singapore
Important Dates
Call For Papers
The topics of interest for submission include, but are not limited to:
Submission & Registration
Regular Registration （Paper 4 pages)
Regular USD 570
Regular Registration （Paper 4 pages)
Regular CNY 3800
Author(Student,Committees)
Regular USD 545
Author(Student,Committees)
Regular CNY 3600
Manuscript numbers ≥ 3
Regular USD 545
Manuscript numbers ≥ 3
Regular CNY 3600
Extra Pages (Begin at Page 5)
Regular USD 60
Extra Pages (Begin at Page 5)
Regular CNY 400
Attendees without Submission
Regular USD 225
Attendees without Submission
Regular CNY 1500
Purchase Extra Conference Proceedings
Regular USD 75
Purchase Extra Conference Proceedings
Regular CNY 500
Publication & Indexing
Committee
Conference General Chairs
Xiaojun Yuan
IEEE Fellow · University of Electronic Science and Technology of China, China
Benjamin W. Wah
Life Fellow of IEEE, Fellow of ACM/AAAS · the Chinese University of Hong Kong, Hong Kong, China
Xuelong Li
Fellow of AAAI/ACM/OSA/IEEE/SPIE · China Telecom, director of the Institute of Artificial Intelligence (TeleAI) of China Telecom, China
Technical Program Committee Chairs
Jun Fang
University of Electronic Science and Technology of China, China
Huiming Wang
IEEE Senior Member · Xi'an Jiaotong University, China
Publication Chairs
Bin Duo
IEEE Member · Chengdu University of Technology, China
Azah Kamilah Muda
IEEE Member, Member of IEEE SMC on Soft Computing · Universiti Teknikal Malaysia Melaka, Malaysia
Organizing Committee Chairs
Xiaoyan Kuai
University of Electronic Science and Technology of China, China
Zhi' An Huang
IEEE Member · City University of Hongkong (Dongguan), China
Organizing Committee
Yinghan Hong
Guangzhou Maritime University, China
Xingli Gan
Zhejiang University of Science and Technology, China
Qi He
University of Electronic Science and Technology of China, China
Zhenqing He
Sichuan University, China
Jiandan Zhong
Chengdu University of Information Technology, China
Xiaochuan Tang
IEEE Member · Chengdu University of Technology, China
Xin Yan
IEEE Member · Wuhan University of Technology, China
Technical Program Committee
Qianqian Zhang
IEEE Member · University of Electronic Science and Technology of China, China
Linsong Du
Southwest Jiaotong University, China
Hongyuan Zhang
The University of Hong Kong, China
Yile Chen
Macau University of Science and Technology, China
Xiang Zhang
IEEE Member, Member of IEEE SMC · Tianjin University, China
Yang Zhao
Harbin Institute of Technology (Weihai), China
Haiquan Zhao
IEEE Senior Member · Southwest Jiaotong University, China
Ela Pustulka
University of Applied Science and Arts Northwestern Switzerland, Olten, Switzerland
Contact
