About the Conference
The 5th International Conference on Artificial Intelligence, Internet and Digital Economy (ICAID 2026) will be held in Harbin, China, from December 25 to 27, 2026. ICAID 2026 serves as a premier forum for researchers, practitioners, and industry experts to explore the latest advances and emerging trends at the intersection of artificial intelligence, internet technologies, and the rapidly evolving digital economy.
In recent years, the convergence of AI, blockchain, and digital platforms has transformed the way businesses operate, governments regulate, and societies interact. ICAID 2026 aims to bring together multidisciplinary perspectives to address the challenges and opportunities arising from these transformative technologies. The conference provides a collaborative environment for discussing innovative solutions in areas such as intelligent decision-making, data-driven analytics, decentralized financial systems, and smart digital infrastructures.
The program will feature keynote presentations, technical sessions, and panel discussions highlighting cutting-edge research and real-world applications. Topics of interest include, but are not limited to, machine learning, deep learning, blockchain and cryptocurrency systems, distributed ledger technologies, digital asset management, e-commerce innovation, and the economic impact of internet technologies.
Subject Areas
Keynote Speakers
Maode Ma
IET Fellow · Qatar University, Katar
Important Dates
Call For Papers
Track 1: Artificial Intelligence & Intelligent Systems
Track 2: Internet Technologies & Networking
Track 3: Blockchain, Cryptocurrency & Digital Assets
Track 4: Digital Economy & E-Commerce Innovation
Submission & Registration
Regular Registration(8 pages)
Regular USD 720
Regular Registration(8 pages)
Regular CNY 4800
Extra Pages (Begin at Page 9)
Regular USD 55
Extra Pages (Begin at Page 9)
Regular CNY 400
Attendees without a Submission
Regular USD 215
Attendees without a Submission
Regular CNY 1500
Attendees without a Submission (Groups）
Regular USD 170
Attendees without a Submission (Groups）
Regular CNY 1200
Purchase Extra Proceedings/Journal copies
Regular USD 70
Purchase Extra Proceedings/Journal copies
Regular CNY 500
Publication & Indexing
Committee
Conference General Chairs
Xiongfeng Pan
Dalian University of Technology, China
Ramayah Thurasamy
Universiti Sains Malaysia, Malaysia
Technical Program Committee Chairs
Ishfaq Ahmad
IEEE Fellow · The University of Texas at Arlington, USA
Chong-Yung Chi
IEEE Fellow · National Tsing Hua University, Taiwan, China
Maode Ma
IET Fellow, IEEE Senior Member · Qatar University, Katar
Local Chairs
Zhen Chen
Dalian University of Technology, China
Lin Zhang
Dalian University of Technology, China
Publication Chairs
Lee Pui Mun
Singapore University of Social Sciences, Singapore
Au Yong Hui Nee
Universiti Tunku Abdul Rahman, Malaysia
Technical Program Committees
Rameez Hassan
Aligarh Muslim University, India
Serhii Bashlai
Sumy State Agricultural University, Ukraine
Amad-Nabi
Dow University, UK
Marco I. Bonelli
Westminster International University, USA
Au Yong Hui Nee
Universiti Tunku Abdul Rahman, Malaysia
K Hemachandran
Woxsen University, India
Li Guanan
Guangzhou University, China
Qasim Abdullah Hassan Al-Ajmi
University of Technology and Applied Sciences, Oman
Hua Wang
Shenzhen Technology University, China
Raja Sarath Kumar Boddu
Lenora College of Engineering, India
Waseem Alhasan
Cairo University, Egypt
Chen Xiangyang
Guangzhou University, China
Sitara Karim
Universiti Utara Malaysia, Malaysia
Raghed Ibrahim
University of Mosul, Iraq
Huang Qiongyu
Guangzhou University, China
Faruk Balli
Massey University, New Zealand
Edward Ng Hon Khay
Singapore Management University, Singapore
Lei Zhang
Sichuan University, China
Yue Guo
Southern University of Science and Technology, China
Said Fathy EL-Zoghdy
Menoufia University, Egypt
Feng Rui
Guangzhou University, China
Mohammad Zoynul Abedin
Hajee Mohammad Danesh Science and Technology University, Bangladesh
Chenggang Wang
Heilongjiang University, China
Gordana Kierans
Shenzhen Technology University, China
Yifu Zhao
Beihang University, China
Contact
