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2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026)
Jun 26-28, 2026
Jinan, China
Jinan, China
wangsiling@ais.cn
Jun 26-28, 2026
Jinan, China
wangsiling@ais.cn

2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026)

June 26 - 28, 2026              Jinan, China

 

Official Website: https://www.icoeei.org/

Date: June 26 - 28, 2026 

Location: Jinan, China

Conference papers will be published by IEEE (ISBN: 979-8-3315-8368-2)

Submitted to these databases: IEEE Xplore, EI Compendex, Scopus

Full Paper Submission Deadline: Mar. 20, 2026   

Registration Deadline: Mar. 20, 2026   

2026 8th International Conference on Electronic Engineering and Informatics (EEI 2026) will be held in Jinan, Shandong, China from June 26 to June 28, 2026. The conference will focus on the latest research progress and technological innovations in the fields of electronic engineering, informatics, and computer science to help promote the national digital economy and intelligent transformation strategy. It will conduct in-depth discussions on major challenges and research directions currently facing the field, and promote the development and application of theory and technology in universities and enterprises. Participants will have the opportunity to share the latest research findings, expand professional networks, and exchange new ideas face-to-face. EEI 2026 will not only provide researchers with the opportunity to present their research results, but also offer participants business and research connections to discover global partners for future careers. Attendees will be able to join high-level academic discussions, broaden their professional networks, seek collaboration opportunities, and jointly promote disciplinary development and applied innovation. We look forward to your participation in exploring future trends and possibilities in electronic engineering and informatics.

 

Sponsored by

 

Supported by

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Topics include but are not limted to:

◕ Track 1: Electronic Technology

· 3D process and integration technology
· Substrate embedding and advanced flip chip packaging
· MEMS and sensor technology
· Design and Analysis of Transmission System
· New materials, equipment and 3D interconnection
· Wearable, flexible and stretchable electronics
· Optical interconnection and 3D photonics
· Digital system and logic design
· Computer architecture and VLSI
· Network-driven multi-core chip
· Advanced robotic system
· Analog and digital electronics
· Signals and Systems

◕ Track 2: Information and Communication

· Electronic equipment
· Satellite and Space Communications
· Network and Information Security
· Signal processing for wireless communication
· Cognitive Radio and Software Radio
· Optical networks and systems
· Electromagnetic field theory
· Antenna, propagation and transmission technology
· Optical communication
· Radar signal and data processing
· Other related topics

 

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All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers will be submitted to IEEE (ISBN: 979-8-3315-8368-2) for publication, and it will be submitted to IEEE Xplore, EI Compendex and Scopus for indexing.

EEI 2026 has been included in the conference list by IEEE!

https://conferences.ieee.org/conferences_events/conferences/conferencedetails/70303

 

1. The submitted papers must not be previously published or under consideration of publication elsewhere.

2. Please send the full paper(word+pdf) to Submission System.

                                       CLICK TO

3. And please submit the full paper if both the presentation and publication are needed.

4. Please submit the Abstract only if you just want to make a oral or poster presentation.

5. Templates: Download.

6. Should you have any questions, or you need any materials in English, please contact us. Email: pansiyuan@ais.cn

 

Note: 

(1) Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is made.

(2) All submitted articles should report original research results, experimental or theoretical, not previously published or under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

 

Registration Fee
Item Price
Regular Registration (4 pages)

570 USD/ paper (4 pages)

3800 CNY/ paper (4 pages)

Extra Pages (Begin at Page 5)

60 USD/ extra page

400 CNY/ extra page

Attendees without a Submission

225 USD/ person

1500 CNY/ person

※Details of the registration fees

1. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.

2. The registration fee does not include:  

   • Accommodation

   • Visa application fee

   • Transportation fare

3. At least one author for each accepted final paper must pre-register. 

4. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.

                                               CLICK TO

 

※Refunds Policy

If the participants request cancellation and refund due to personal reasons, the following refund policy applies.

* 60 days ahead of the conference: 70% of payment refund

* 30-60 days ahead of the conference: 50% of payment refund

* Within 30 days ahead of the conference: 30% of payment refund

* After conference: no refund

Cancellation and refund request must be made formally by email.

The organizing committees reserves the right to change the dates and place of the conference due to force majeure. Losses thus incurred from the force majeure events shall not be liabled and refunds policy shall not apply as well.

 

Date Time Activity
Jun. 26 14:00-17:00 Sign-in
Jun. 27 09:00-09:30 Opening Ceremony
09:30-12:00 Keynote Speeches
12:00-14:00 Lunch Time
14:00-18:00

Oral Presentations

Poster Display

Jun. 28 09:00-18:00 Academic Tour

 

Conference Secretary: Summer Pan

Tel: +86-18922107265 (WeChat)

E-Mail: pansiyuan@ais.cn

 

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