Filter
Clear
Date
-
Subjects
Countries/Regions
Index
2026 International Conference on Artificial Intelligence and Simulation (CAIS 2026)
Sep 28 - 30, 2026
Submission Deadline: Sep 7, 2026
Kuala Lumpur, MalaysiaIEEE Xplore
2nd International Conference on Green Materials and Manufacturing Technology（GMMT 2026）
Oct 9 - 11, 2026Submission Deadline: Sep 25, 2026Cambridge, United KingdomEIScopus
2026 7th International Conference on Education, Knowledge and Information Management (ICEKIM 2026)
Oct 15 - 17, 2026Submission Deadline: Oct 2, 2026Cambridge, United KingdomEIScopus
2026 3rd International Conference on Digital Media, Communication and Information Systems(DMCIS 2026)
Oct 23 - 25, 2026Submission Deadline: Sep 23, 2026Busan, Korea (South)EIScopus
The 2nd International Symposium on Machine Learning and Social Computing
Oct 26 - 28, 2026Submission Deadline: Oct 12, 2026Bangkok, ThailandEIScopus
SAE 2026 Intelligent and Connected Vehicles Symposium - 9th Annual
Oct 29 - 31, 2026Submission Deadline: Oct 9, 2026Wuhan, ChinaEIScopus
2026 3rd International Conference on Smart Healthcare and Wearable Intelligent Devices （SHWID 2026）
Oct 30 - Nov 1, 2026Submission Deadline: Oct 16, 2026Kuala Lumpur, MalaysiaEIScopus
2026 International Conference on Green Energy and Artificial Intelligence (GEAI 2026)
Nov 20 - 22, 2026Submission Deadline: Aug 31, 2026NTU-Alumni Club, SingaporeEIScopus
2026 2nd International Conference on Medical Image Processing and Recognition (IPOR 2026)
Nov 27 - 29, 2026Submission Deadline: Nov 13, 2026Kuala Lumpur, MalaysiaEIScopus
The International Conference on Advanced Manufacturing and Smart Materials 2026（AMSM 2026）& CfAMT Research Symposium 2026
Dec 2 - 4, 2026Submission Deadline: Nov 26, 2026Sydney, AustraliaEIScopus
AiScholar serves as a one-stop digital platform dedicated to facilitating academic and scientific research.
Email: customer_services@aischolar.com
Accepted Payment Methods:
Committed to the COPE etc. guidelines
Cooperative Partners
Copyright © 2025 - 2026 AiScholar. All Rights Reserved.