2027 6th International Conference on Electronic Information Engineering and Data Processing

http://www.eiedp.net/

The Hong Kong Polytechnic University Jinjiang Technology and Innovation Research Institute, Building 18, R&D Design Center, Sanchuangyuan (Innovation Park), No. 3001 South Shiji Avenue, Jinjiang City

Jan 15 - 17, 2027

http://www.eiedp.net/

The Hong Kong Polytechnic University Jinjiang Technology and Innovation Research Institute, Building 18, R&D Design Center, Sanchuangyuan (Innovation Park), No. 3001 South Shiji Avenue, Jinjiang City

Quanzhou, China

iceiedp@126.com

Jan 15 - 17, 2027

Quanzhou, China

iceiedp@126.com

About the Conference

Welcome to the official website of 2027 6th International Conference on Electronic Information Engineering and Data Processing (EIEDP 2027). 2027 6th International Conference on Electronic Information Engineering and Data Processing (EIEDP 2027) will be held on January 15-17, 2027 in Quanzhou, China. EIEDP 2027 is to bring together innovative academics and industrial experts in the field of Electronic Information Engineering and Data Processing to a common forum. The primary goal of the conference is to promote research and developmental activities in Electronic Information Engineering and Data Processing and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in electronic information engineering and data processing and related areas. We warmly invite you to participate in EIEDP 2027.

Subject Areas

Electronic Information Engineering Optoelectronics and Photonics Data Processing and Computing

Keynote Speakers

Bo Dong

Professor · Shenzhen Technology University, China

Changyuan Yu

Professor, OSA Fellow · The Hong Kong Polytechnic University, China

Important Dates

2026-11-01 Full Paper Submission Date NEXT

2026-12-01 Notification Date

2026-12-15 Final Paper Submission Date

2026-12-01 Early Bird Registration for Paper (4-6 pages) · Before December 1, 2026

2027-01-15 ~ 01-17 Conference Dates · January 15-17, 2027

Call For Papers

Electronic Information Engineering

Electronic Devices and Circuits Semiconductor Materials and Technology Sensor Systems and Applications RF and Microwave Engineering Embedded Electronic Systems Power Electronics and Reliability Electronic Packaging and Integration Smart Grid Electronics Industrial Electronics Emerging Electronic Technologies

Optoelectronics and Photonics

Optoelectronic Devices and Applications Photonic Materials and Structures Optical Communication Systems Laser Technology and Applications Imaging and Sensing Technologies Nonlinear Optics and Photonics Integrated Photonic Circuits Quantum Optics and Photonics Biomedical Optics Advanced Photonic Applications

Data Processing and Computing

Artificial Intelligence and Machine Learning Computer Vision and Image Processing Natural Language Processing Big Data Analytics Cloud and Edge Computing High-Performance Computing Algorithms and Computational Methods Software Engineering and Systems Cybersecurity and Data Protection Distributed Computing Systems

Submission & Registration

Submit a Paper Register Paper Template

GuidelinesThe submitted papers must not be under consideration elsewhere.,Please send the full paper (word+pdf) to Submission System.,Please submit the full paper, if presentation and publication are both needed.,Please submit the abstract only, if you just want to make presentations.,Both Abstract and Full Paper are welcomed. The author can make an oral presentation after the Abstract is accepted and the payment is finished.

Regular Registration(4 - 6 pages)

Regular USD 545

Regular Registration(4 - 6 pages)

Regular CNY 3800

Early Bird Registration for Paper (4 -6 pages) Before December 1, 2026

Early USD 485

Early Bird Registration for Paper (4 -6 pages) Before December 1, 2026

Early CNY 3400

Student Registration(4 - 6 pages)

Regular USD 515

Student Registration(4 - 6 pages)

Regular CNY 3600

Extra Pages (Begin at Page 7)

Regular USD 55

Extra Pages (Begin at Page 7)

Regular CNY 400

Attendees without Submission

Regular USD 215

Attendees without Submission

Regular CNY 1500

Attendees without Submission (Groups）

Regular USD 185

Attendees without Submission (Groups）

Regular CNY 1300

Publication & Indexing

PublisherSPIE - The International Society for Optical Engineering

IndexingEI Compendex, Scopus

ISBN / ISSN0277-786X

Conference Organization

In cooperation with

The Hong Kong Polytechnic University Jinjiang Technology and Innovation Research Institute

Contact

Emailiceiedp@126.com

Registration Submission